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Publications by Amaneh Tasooji
Effect of Grain Boundary Misorientation on Electromigration in Lead-Free Solder Joints
Journal of Electronic Materials
Electronic Engineering
Condensed Matter Physics
Optical
Materials Chemistry
Electrical
Magnetic Materials
Electronic
Related publications
Concurrent Electromigration and Creep in Lead-Free Solder
Journal of Applied Physics
Astronomy
Physics
Effect of Grain-Boundary Misorientation on Dynamic Recrystallization of Cu-Si Bicrystals
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
The Characteristics of Electromigration and Thermomigration in Flip Chip Solder Joints
Effect of Void Propagation on Bump Resistance Due to Electromigration in Flip-Chip Solder Joints Using Kelvin Structure
Applied Physics Letters
Astronomy
Physics
Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Lead-Free Solder Paste and VOC-Free Solder Paste.
Journal of SHM
Mechanical Characterization of Lead-Free Sn-Ag-Cu Solder Joints by High-Temperature Nanoindentation
Journal of Electronic Materials
Electronic Engineering
Condensed Matter Physics
Optical
Materials Chemistry
Electrical
Magnetic Materials
Electronic
Fatigue Characteristics of Lead-Free Solder Alloys.
Materia Japan
Growth Kinetics of Reaction Layers in Flip Chip Joints With Cu-Cored Lead-Free Solder Balls
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
