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Publications by Andreas Vlahinos

Sensitivity of Solder Joint Fatigue to Sources of Variation in Advanced Vehicular Power Electronics Cooling

English

Related publications

Potential Refrigerants for Power Electronics Cooling

English

Coarsening of the Sn-Pb Solder Microstructure in Constitutive Model-Based Predictions of Solder Joint Thermal Mechanical Fatigue

Journal of Electronic Materials

Electronic Engineering

Condensed Matter Physics

Materials Chemistry

Magnetic Materials

English

Overcoming Fatigue Through Compression for Advanced Elastocaloric Cooling

Materials Science

Theoretical Chemistry

Condensed Matter Physics

English

Effect of Viscoelasticity of Ethylene Vinyl Acetate Encapsulants on Photovoltaic Module Solder Joint Degradation Due to Thermomechanical Fatigue

Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

English

Thermal Fatigue Life Evaluation of Lead-Free Solder Joint of Chip Size Package With Underfill

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

Mechanics of Materials

Materials Chemistry

Condensed Matter Physics

English

Fatigue Characteristics of Lead-Free Solder Alloys.

English

Electric Vehicle Power Electronics Cooling System Pump Control Using Fuzzy Logic

International Journal of Advanced Computer Research

Electronic Engineering

Computer Science

English

A Survey on Power-Electronics Interface for Renewable Energy Sources

International Journal of Engineering Research and

English

Joint Services Electronics Program Research in Electronics.

English