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Publications by Anh Kiet Tieu
Simultaneous Grain Growth and Grain Refinement in Bulk Ultrafine-Grained Copper Under Tensile Deformation at Room Temperature
Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
Mechanics of Materials
Alloys
Condensed Matter Physics
Metals
Related publications
Grain Size Variation During Low Temperature Creep and Tensile Deformation of Ultrafine-Grained Copper
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Molecular Dynamics Simulation on Σ5 Grain Boundaries of Copper Bicrystal Under Tensile and Shear Deformation
Materials Research Society Symposium - Proceedings
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
The Strength–Grain Size Relationship in Ultrafine-Grained Metals
Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
Mechanics of Materials
Alloys
Condensed Matter Physics
Metals
Grain Boundary Sliding in High-Purity Aluminium Bicrystal During Tensile Deformation at High Temperature
Transactions of the Japan Institute of Metals
Grain Refinement and High-Temperature Deformation Behaviour of Sub-Zero Worked and Annealed SUS316L
Tetsu-To-Hagane/Journal of the Iron and Steel Institute of Japan
Alloys
Condensed Matter Physics
Metals
Theoretical Chemistry
Materials Chemistry
Physical
Superplasticity and Deformation Induced Grain Growth
Tetsu-To-Hagane/Journal of the Iron and Steel Institute of Japan
Alloys
Condensed Matter Physics
Metals
Theoretical Chemistry
Materials Chemistry
Physical
Superplasticity and Deformation Induced Grain Growth.
ISIJ International
Mechanics of Materials
Alloys
Materials Chemistry
Metals
Mechanical Engineering
Prediction of Grain Deformation in Drawn Copper Wire
MATEC Web of Conferences
Materials Science
Engineering
Chemistry
Tensile Deformation of Aluminum as a Function of Temperature, Strain Rate, and Grain Size
