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Publications by Asao NISHIMURA
Evaluation of Interface Delamination in IC Packages Considering the Swelling of Molding Compound Due to Moisture Absorption.
Transactions of the Japan Society of Mechanical Engineers Series A
Stress Intensity Factor for a Semi-Elliptical Crack in an Internally Pressurized Cylinder
Transactions of the Japan Society of Mechanical Engineers
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Stress Analysis and Its Application to Structure Design for IC Plastic Packages.
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Local Delamination Buckling of a Laminated Beam Due to Three-Point Bending
Transactions of the Japan Society of Mechanical Engineers Series A
Improvement on Leakage Current Performance of Semiconductor IC Packages by Eliminating ESD Events
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Utilization of Crushed FRP for Bulk Molding Compound Additives.
Zairyo/Journal of the Society of Materials Science, Japan
Mechanics of Materials
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Condensed Matter Physics
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Bi‐phasic Water Diffusion in Sheet Molding Compound Composite
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Films
Coatings
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Chemical and Mechanical Damage in Concrete Due to Swelling of Alkali-Silica Gel
