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Publications by Ate He
Low-Temperature Bonding of Copper Pillars for All-Copper Chip-To-Substrate Interconnections
Electrochemical and Solid-State Letters
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Low Temperature Annealing Stages of Irradiated Copper
Proceedings of the Japan Academy
Bondability of Copper Joints Formed Using a Mixed Paste of Ag2O and CuO for Low-Temperature Sinter Bonding
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Condensed Matter Physics
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Low Temperature Thermodynamic Properties of Precipitation-Hardening Copper-Beryllium Alloys
A Low-Temperature Solution-Processed Copper Antimony Iodide Rudorffite for Solar Cells
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Growth Mechanism for Low Temperature PVD Graphene Synthesis on Copper Using Amorphous Carbon
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A Simple and Low-Cost Chip Bonding Solution for High Pressure, High Temperature and Biological Applications
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Low-Temperature Direct Bonding of Flip-Chip Mountable VCSELs With Au-Au Surface Activation
IEEJ Transactions on Sensors and Micromachines
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Low-Temperature Catalytic Reduction of Nitrogen Monoxide With Carbon Monoxide on Copper Iron and Copper Cobalt Composite Oxides
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On the Copper (II) - Catalyzed Low Temperature Decomposition of Ammonium Perchlorate
