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Publications by B. Heusdens
Evaluation of Aerosol Jet Printing (AJP) Technology for Electronic Packaging and Interconnect Technique
Related publications
Analytical Investigation of Aerosol Jet Printing
Aerosol Science and Technology
Materials Science
Pollution
Environmental Chemistry
Aerosol Jet Printing for the Manufacture of Soft Robotic Devices
Packaging Technologies of Optical Circuits. Optical Subsystem Interconnect Technology.
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
Future Plating Technology for Next Generation High Density Electronic Packaging
Journal of The Surface Finishing Society of Japan
Applicatons of Ink-Jet Printing Technology to BioMEMS and Microfluidic Systems
JALA: Journal of the Association for Laboratory Automation
Electronic Packaging Technology View From System Design. Packaging Technology Made New Capability in Electronics Use.
Journal of the Surface Finishing Society of Japan
Substrate Interconnect Technologies for 3-D MEMS Packaging
Microelectronic Engineering
Surfaces
Electronic Engineering
Condensed Matter Physics
Electronic
Molecular Physics,
Nanoscience
Optical
Electrical
Atomic
Magnetic Materials
Films
Nanotechnology
Optics
Coatings
Full Color QLEDs Display Fabricated by Ink-Jet Printing Technique
Special Edition: Electronic Image Technology in Publishing. Status and Trend of the Printing Technology.
The Journal of the Institute of Television Engineers of Japan
