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Publications by C. Kuranaga

Photoacoustic Imaging of Voids in Direct Wafer Bonding

Review of Scientific Instruments

Instrumentation

English

Related publications

Permanent Wafer Bonding and Temporary Wafer Bonding / De-Bonding Technology Using Temperature Resistant Polymers

Journal of Photopolymer Science and Technology

Organic Chemistry

Materials Chemistry

English

Three-Dimensional Imaging for Indirect-Direct Bonding

American Journal of Orthodontics and Dentofacial Orthopedics

English

A Comparative Study of the Bonding Energy in Adhesive Wafer Bonding

Journal of Micromechanics and Microengineering

Mechanics of Materials

Electronic Engineering

Mechanical Engineering

Magnetic Materials

English

Low-Temperature Wafer Bonding for Three-Dimensional Wafer-Scale Integration

English

Photoacoustic Imaging.

English

Silicon Waveguides Produced by Wafer Bonding

Applied Physics Letters

English

Characterization of GaAs-based N-N and P-N Interface Junctions Prepared by Direct Wafer Bonding

Journal of Applied Physics

English

Photoacoustic Imaging of Epilepsy

English

Direct Wafer Bonding of Highly Conductive GaSb/GaInAs and GaSb/GaInP Heterojunctions Prepared by Argon-Beam Surface Activation

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Condensed Matter Physics

English