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Publications by Chang-Kyu Chung
Wafer-Level Flip Chip Packages Using Preapplied Anisotropic Conductive Films (ACFs)
IEEE Transactions on Electronics Packaging Manufacturing
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Reliability of Flip Chip Package^|^mdash;Thermal Stress on Flip Chip Joint^|^mdash;
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Millimeter-Wave Flip-Chip IC Module.
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Under Bump Metallisation of Fine Pitch Flip-Chip Using Electroless Nickel Deposition
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Fluxless Flip-Chip Bonding of Single Photodetector Chips Using Laser-Induced Forward Transfer
