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Publications by Cheng. Lu
Molecular Dynamics Simulation on Σ5 Grain Boundaries of Copper Bicrystal Under Tensile and Shear Deformation
Materials Research Society Symposium - Proceedings
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
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Simultaneous Grain Growth and Grain Refinement in Bulk Ultrafine-Grained Copper Under Tensile Deformation at Room Temperature
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Effect of Stress State on Deformation and Fracture of Nanocrystalline Copper: Molecular Dynamics Simulation
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Grain Boundary Sliding in High-Purity Aluminium Bicrystal During Tensile Deformation at High Temperature
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