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Publications by Chien-Kuo Huang
Prediction of Grain Deformation in Drawn Copper Wire
MATEC Web of Conferences
Materials Science
Engineering
Chemistry
Related publications
Simultaneous Grain Growth and Grain Refinement in Bulk Ultrafine-Grained Copper Under Tensile Deformation at Room Temperature
Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
Mechanics of Materials
Alloys
Condensed Matter Physics
Metals
Grain Size Variation During Low Temperature Creep and Tensile Deformation of Ultrafine-Grained Copper
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Molecular Dynamics Simulation on Σ5 Grain Boundaries of Copper Bicrystal Under Tensile and Shear Deformation
Materials Research Society Symposium - Proceedings
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Bismuth in Copper Grain Boundaries
JOM
Materials Science
Engineering
Influences of Recovery and Recrystallization Interannealing on Properties of Hard Drawn Aluminium Wire
DEStech Transactions on Engineering and Technology Research
Creep Rates of Cold-Drawn Nickel-Copper Alloy (Monel Metal)
Journal of Research of the National Bureau of Standards
Microbands in 80% Drawn Copper Single Crystals With and Starting Orientations
Texture
Recycling Option of the Wrong Length Copper Wire
KnE Materials Science
Mechanisms of Increase in Mechanical Strength and Heat Resistance of Si-Enriched Hard Drawn Steel Wire.
Transactions of Japan Society of Spring Engineers
