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Publications by Chin-Hao Yang
Copper Interconnects Grown by Electrochemical Displacing the Prepatterned SiC Barrier Thin Film
Electrochemical and Solid-State Letters
Related publications
ZnO:Cu Thin Films and P-N Homojunctions Grown by Electrochemical Deposition
Copper Thin Film of Alternating Textures
Applied Physics Letters
Astronomy
Physics
Dominant Factor on Fracture Strength of Thin Film Comprising of Copper Helical Nano-Elements Grown by Glancing Angle Deposition
Transactions of the JSME (in Japanese)
Electrochemical Synthesis and Corrosion Behavior of Thin Polyaniline Film on Mild Steel, Copper and Aluminum
Hemijska Industrija
Chemistry
Chemical Engineering
Outstanding Property in Fatigue Strength of Thin Film Comprising of Copper Helical Nano-Elements Grown by Glancing Angle Deposition
Zairyo/Journal of the Society of Materials Science, Japan
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Bright Green-Color Thin-Film EL Devices Grown by Rf-Sputtering.
The Journal of the Institute of Television Engineers of Japan
Mechanism of Electromigration Failure in Al Thin Film Interconnects Containing Sc
Materials Research Society Symposium - Proceedings
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Nanocarbon-Copper Thin Film as Transparent Electrode
Applied Physics Letters
Astronomy
Physics
An Electrochemical Investigation of Additive Effect in Trench-Filling of ULSI Interconnects by Electroless Copper Deposition
Electrochemistry
Electrochemistry
