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Publications by Christian Ohde

Upscaling Panel Size for Cu Plating on FOPLP (Fan Out Panel Level Packaging) Applications to Reduce Manufacturing Cost

International Symposium on Microelectronics

English

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Panel Commentary: Screening Applications

International Journal of Mental Health and Addiction

English

Presidential Panel Lays Out Options for NASA's Future

Multidisciplinary

English

Panel on Some Issues on Testing Theory and Its Applications

English

Grouped Coefficients to Reduce Bias in Heterogeneous Dynamic Panel Models With smallT

Applied Economics

English

Multi-Level Confined Error Diffusion Algorithm for Flat Panel Display

IEICE Transactions on Information and Systems

Electronic Engineering

Pattern Recognition

Computer Vision

Artificial Intelligence

English

Panel on Intrusion Detection

IFIP Advances in Information and Communication Technology

Computer Networks

Information Systems

English

Is Crowding Out Due Entirely to Fundraising? Evidence From a Panel of Charities

English

Compliant Press-Fit Technology Integrated Into a New Back Panel Packaging Approach

ElectroComponent Science and Technology

English

Capital–energy Substitution: Evidence From a Panel of Irish Manufacturing Firms

Energy Economics

English