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Publications by Christian Prommesberger
Improvement of Homogeneity and Aspect Ratio of Silicon Tips for Field Emission by Reactive-Ion Etching
Advances in Materials Science and Engineering
Materials Science
Engineering
Related publications
Anisotropic Bulk Etching of (110) Silicon With High Aspect Ratio
IEEJ Transactions on Sensors and Micromachines
Electronic Engineering
Electrical
Mechanical Engineering
High Aspect Ratio Etching of Atomic Force Microscope-Patterned Nitrided Silicon
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
The Study of Latex Sphere Lithography for High Aspect Ratio Dry Silicon Etching
Physica Status Solidi (A) Applications and Materials Science
Surfaces
Electronic Engineering
Condensed Matter Physics
Materials Chemistry
Optical
Electrical
Magnetic Materials
Films
Coatings
Electronic
Interfaces
Reactive Ion Etching of PECVD Silicon Dioxide (SiO2) Layer for MEMS Application
Fabrication of Optical Wave-Guides in Silica-On-Silicon by Nickel Electroplating and Conventional Reactive Ion Etching
Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
Engineering
Astronomy
Physics
3D Free-Form Patterning of Silicon by Ion Implantation, Silicon Deposition, and Selective Silicon Etching
Advanced Functional Materials
Materials Science
Condensed Matter Physics
Electrochemistry
Nanoscience
Optical
Biomaterials
Magnetic Materials
Nanotechnology
Chemistry
Electronic
Reactive Ion Etching of Quartz and Pyrex for Microelectronic Applications
Journal of Applied Physics
Astronomy
Physics
Enhanced Electrochemical Etching of Ion Irradiated Silicon by Localized Amorphization
Applied Physics Letters
Astronomy
Physics
Effect of Aspect Ratio on Field Emission Properties of ZnO Nanorod Arrays
Nanoscale Research Letters
Materials Science
Nanotechnology
Condensed Matter Physics
Nanoscience
