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Publications by Chu Yee Khor

SAC–xTiO2 Nano-Reinforced Lead-Free Solder Joint Characterizations in Ultra-Fine Package Assembly

Soldering and Surface Mount Technology

Electronic Engineering

Condensed Matter Physics

Materials Science

English

Related publications

Thermal Fatigue Life Evaluation of Lead-Free Solder Joint of Chip Size Package With Underfill

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

Mechanics of Materials

Materials Chemistry

Condensed Matter Physics

English

Lead-Free Solder Paste and VOC-Free Solder Paste.

English

Concurrent Electromigration and Creep in Lead-Free Solder

Journal of Applied Physics

English

Fatigue Characteristics of Lead-Free Solder Alloys.

English

Recent Situation of Lead-Free Solder Technology

Yosetsu Gakkai Shi/Journal of the Japan Welding Society

Mechanics of Materials

Mechanical Engineering

English

Microstructures and Properties of New Sn–Ag–Cu Lead-Free Solder Reinforced With Ni-Coated Graphene Nanosheets

Journal of Alloys and Compounds

Mechanics of Materials

Materials Chemistry

Mechanical Engineering

English

Coupled Microstructural and Calorimetric Investigation of Controlled Solder Joint Microstructures in Pb-Free Solder

Microscopy and Microanalysis

Instrumentation

English

Fine Pitch and Low Temperature Bonding Using Solder Bumps and the Assessment of Solder Joint Reliability

Materials Transactions

Mechanics of Materials

Materials Science

Condensed Matter Physics

Mechanical Engineering

English

Effect of Multiple Reflows on the Mechanical Reliability of Solder Joint in LED Package

Journal of Korean Institute of Metals and Materials

Magnetic Materials

English