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Publications by Chul Min Oh
Cu Corrosion Test Method for Lead-Free Solders
Journal of Welding and Joining
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Acetic Acid Mediated Leaching of Metals From Lead-Free Solders
Bioresources and Bioprocessing
Renewable Energy
Food Science
Sustainability
Biotechnology
Biomedical Engineering
the Environment
High-Temperature Shear Strength and Hardness of Cast Lead-Free Solders
Kovove Materialy
Mechanics of Materials
Alloys
Materials Chemistry
Metals
Mechanical Engineering
Effect of Excess Temperature Above Liquidus of Lead-Free Solders on Wetting Time in a Wetting Balance Test
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
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Wetting Properties of and Interfacial Reactions in Lead-Free Sn-Zn Based Solders on Cu and Cu Plated With an Electroless Ni-P/Au Layer
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Formation of Kirkendall Voids in the Reactive Diffusion Between Cu Plate and Lead-Rich Solders
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Relationship Between Mechanical Properties of Lead-Free Solders and Their Heat Treatment Parameters
Journal of Materials Engineering and Performance
Mechanics of Materials
Materials Science
Mechanical Engineering
Microstructure and Mechanical Properties of Partial Melted Joint Using Off Eutectic Lead-Free Solders
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Rupture Life of CSP Solder Joints With Sn-Ag Lead-Free Solders Under Thermal Cycle Condition.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
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The Effects of Aging of the Cyclic Stress-Strain and Fatigue Behaviors of Lead Free Solders
