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Publications by Chung-Kuang Lin
Formation Mechanism of Porous Cu3Sn Intermetallic Compounds by High Current Stressing at High Temperatures in Low-Bump-Height Solder Joints
Crystals
Materials Science
Inorganic Chemistry
Chemical Engineering
Condensed Matter Physics
Related publications
High Speed Oblique CT System for Solder Bump Inspection
Experiments in Corrosion Mechanism: Aluminum at High Temperatures
High Reliability Design for Micro Solder Joints by Means of Computational Mechanics.
Journal of SHM
High-Precision Cutting of Titanium Aluminide Intermetallic Compounds.
Nippon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C
Mechanics of Materials
Industrial
Mechanical Engineering
Manufacturing Engineering
Mechanical Characterization of Lead-Free Sn-Ag-Cu Solder Joints by High-Temperature Nanoindentation
Journal of Electronic Materials
Electronic Engineering
Condensed Matter Physics
Optical
Materials Chemistry
Electrical
Magnetic Materials
Electronic
Mechanical Properties of High Purity Iron at Low Temperatures
Transactions of the Japan Institute of Metals
Pb-Free High Temperature Solder Joints for Power Semiconductor Devices
Transactions of The Japan Institute of Electronics Packaging
Magnetic Susceptibility and Parameters of Electronic Structure of Al2R (R = La, Ce, Sm, Gd, Dy, Ho, Yb) Intermetallic Compounds at High Temperatures.
EPJ Web of Conferences
Astronomy
Physics
Perovskite-Type Oxids With Low Resistivity and High Stability at High Temperatures in Air
Funtai Oyobi Fummatsu Yakin/Journal of the Japan Society of Powder and Powder Metallurgy
Alloys
Industrial
Mechanical Engineering
Metals
Materials Chemistry
Manufacturing Engineering
