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Publications by Chung-Seok Kim

Thermal Damage Characterization of Silicon Wafer Subjected to CW Laser Beam

Transactions of the Korean Society of Mechanical Engineers, A

Mechanical Engineering

English

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Modelling of Thermal Damage Process in Soft Tissue Subjected to Laser Irradiation

Journal of Applied Mathematics and Computational Mechanics

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Reduction of Thermal Conductivity in Wafer-Bonded Silicon

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Evaluation of Subsurface Damage in Silicon Wafer Based on Deflection Analysis

Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering

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Fast Laser Beam Characterization

Optik & Photonik

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Fast Laser Beam Characterization

Laser Technik Journal

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Dicing Process for Thin Silicon Wafer by Using Femtosecond-Laser

Journal of the Japan Society for Precision Engineering, Contributed Papers

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Generalized Thermoelasticity Problem of Material Subjected to Thermal Loading Due to Laser Pulse

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Characterization of Thermal Neutron Beam Monitors

Physical Review Accelerators and Beams

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Nonlinear Dynamics of a Reduced Multimodal Timoshenko Beam Subjected to Thermal and Mechanical Loadings

Mechanics of Materials

Condensed Matter Physics

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