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Publications by D Riegner

Coupled Microstructural and Calorimetric Investigation of Controlled Solder Joint Microstructures in Pb-Free Solder

Microscopy and Microanalysis

Instrumentation

English

Related publications

Development of Pb-Free Solder Distributed Conductive Plastics.

Journal of Japan Institute of Electronics Packaging

Electronic Engineering

English

Lead-Free Solder Paste and VOC-Free Solder Paste.

English

Coarsening of the Sn-Pb Solder Microstructure in Constitutive Model-Based Predictions of Solder Joint Thermal Mechanical Fatigue

Journal of Electronic Materials

Electronic Engineering

Condensed Matter Physics

Materials Chemistry

Magnetic Materials

English

The Review of Mounting Technology With Pb-Free Solder.

English

Structure and Kinetics of Sn Whisker Growth on Pb-Free Solder Finish

English

Pb-Free High Temperature Solder Joints for Power Semiconductor Devices

Transactions of The Japan Institute of Electronics Packaging

English

Concurrent Electromigration and Creep in Lead-Free Solder

Journal of Applied Physics

English

Microstructural Evolution of Eutectic Au-Sn Solder Joints

English

In Situ Investigation of SnAgCu Solder Alloy Microstructure

Journal of Alloys and Compounds

Mechanics of Materials

Materials Chemistry

Mechanical Engineering

English