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Publications by D. Riphagen
Application of Conductive Adhesives in Microcircuits for “Long-Life” Equipment
ElectroComponent Science and Technology
Related publications
Application of Conductive Adhesives in Microcircuits for “Long-Life” Equipment
Microelectronics Reliability
Surfaces
Electronic Engineering
Condensed Matter Physics
Electronic
Molecular Physics,
Nanoscience
Films
Optical
Electrical
Atomic
Magnetic Materials
Nanotechnology
Reliability
Safety
Coatings
Optics
Quality
Risk
Structural Electrically Conductive Adhesives
Journal of The Adhesion Society of Japan
Thermally Conductive Electrically Insulating Adhesives for Assembly of Microelectronic Products
ELECTRONICS: Science, Technology, Business
Preparation of Electrically Conductive Adhesives Modified With AgNO3
Micro-Interconnection Technology. Electronic Interconnection With Conductive Adhesives.
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
Innovative Electrically Conductive Adhesives: Nickel-Free and Cost-Effective
Adhesion Adhesives and Sealants
Polymers
Chemistry
Chemical Engineering
Plastics
A Novel Preparation Method of Electrically Conductive Adhesives by Powder Spraying Process
Materials
Materials Science
Condensed Matter Physics
Demethylation of Wheat Straw Alkali Lignin for Application in Phenol Formaldehyde Adhesives
Polymers
Polymers
Plastics
Chemistry
Application of Simulation Analysis for Equipment Monitoring
DEStech Transactions on Computer Science and Engineering
