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Publications by D.C. Whalley
Process Variables in the Reflow Soldering of Surface Mount
Novel Rework Techniques for Electronic Assemblies
A Substrateless Process for Sustainable Manufacture of Electronic Assemblies
Solder Paste Reflow Modeling for Flip Chip Assembly
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Optimisation of Reflow Profile of Surface Mount Assembly Using Taguchi Design of Experiments
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The Ontology Based FMEA of Lead Free Soldering Process
Optimization of Analytical Methods Using Response Surface Methodology - Part I: Process Variables
Revista Virtual de Quimica
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Control of the Induction Soldering on the Basis of Process Temperature Indirect Measurements
MATEC Web of Conferences
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Soldering Technology. Soldering Methods and Equipments.
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Optimisation for Surface Mount Placement Machines
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