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Publications by Dae-Gon Kim
Microstructure and Mechanical Properties of Sn–0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Related publications
Electrolytic Deposition of Fine Pitch Sn/Cu Solder Bumps for Flip Chip Packaging
International Symposium on Microelectronics
Optoelectronic and Microwave Transmission Characteristics of Indium Solder Bumps for Low-Temperature Flip-Chip Applications
IEEE Transactions on Advanced Packaging
Fatigue Damage Evaluation by Surface Feature for Sn–3.5Ag and Sn–0.7Cu Solders
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Study on Sn–Ag Oxidation and Feasibility of Room Temperature Bonding of Sn–Ag–Cu Solder
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Solder Paste Reflow Modeling for Flip Chip Assembly
Mechanical Properties and Microstructure of Tin-Silver-Bismuth Lead-Free Solder
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Coarsening of the Sn-Pb Solder Microstructure in Constitutive Model-Based Predictions of Solder Joint Thermal Mechanical Fatigue
Journal of Electronic Materials
Electronic Engineering
Condensed Matter Physics
Optical
Materials Chemistry
Electrical
Magnetic Materials
Electronic
Microstructure and Mechanical Properties of Harmonic-Structured Cu–Sn Alloy
Funtai Oyobi Fummatsu Yakin/Journal of the Japan Society of Powder and Powder Metallurgy
Alloys
Industrial
Mechanical Engineering
Metals
Materials Chemistry
Manufacturing Engineering
The Characteristics of Electromigration and Thermomigration in Flip Chip Solder Joints
