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Publications by Daisuke CHIBA
Electric Reliability Evaluation of Cover Lay Coated Double Layered Copper Clad Laminate by Use of AC Impedance Spectroscopy
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Related publications
Evaluation of Electric Reliability for Flexible Printed Circuit Boards With Anisotropic Conductive Film by AC Impedance Method
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
AC Impedance Spectroscopy of Native DNA and M-Dna
Biophysical Journal
Biophysics
Evaluation of Passive Films by Photo and Impedance Spectroscopy.
Materia Japan
Active Content Determination of Non-Coated Pharmaceutical Pellets by Near Infrared Spectroscopy: Method Development, Validation and Reliability Evaluation
Talanta
Biochemistry
Analytical Chemistry
Spectroscopy
Determination of the Transport Properties of Structural Concrete Using AC Impedance Spectroscopy Techniques
Journal of Engineering (United States)
Electronic Engineering
Industrial
Mechanical Engineering
Civil
Structural Engineering
Manufacturing Engineering
Hardware
Electrical
Chemical Engineering
Architecture
Single-Molecule Measurement and Its Application by Electric Impedance Spectroscopy Using Nanochannel
Bunseki Kagaku
Analytical Chemistry
Evaluation of Reaction Property of Anodized Carbon Electrode by Electrochemical Impedance Spectroscopy
Journal of The Surface Finishing Society of Japan
Freezing of Water in Portland Cement Paste – An Ac Impedance Spectroscopy Study
Cement and Concrete Composites
Building
Materials Science
Construction
Surface Damage Evaluation of Tungsten/Copper Composites by Electric Arcing Test
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
