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Publications by David A. Hutt
Ultrasound Assisted Dispersal of a Copper Nanopowder for Electroless Copper Activation
Ultrasonics Sonochemistry
Organic Chemistry
Ultrasonics
Radiology
Environmental Chemistry
Acoustics
Nuclear Medicine
Inorganic Chemistry
Chemical Engineering
Imaging
Polymer Optical Waveguide Fabrication Using Laser Ablation
Related publications
Optimization of a Pretreatment for Copper Electroless Deposition on Ta Substrates
Journal of the Electrochemical Society
Surfaces
Condensed Matter Physics
Optical
Electrochemistry
Sustainability
Materials Chemistry
Magnetic Materials
Renewable Energy
Films
Coatings
Electronic
the Environment
Direct Electroless Copper Plating on Alumina Ceramics.
Circuit Technology
Recrystallized Ice-Templated Electroless Plating for Fabricating Flexible Transparent Copper Meshes
RSC Advances
Chemistry
Chemical Engineering
Formation of the Porous Film by Electroless Copper Plating.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Application of Precision Filtration on Electroless Copper Plating Bath.
Journal of the Surface Finishing Society of Japan
Novel Formaldehyde-Free Electroless Copper for Plating on Next-Generation Substrates
International Symposium on Microelectronics
Copper Complex-Assisted DNA Hybridization
Plasma Graft Copolymerization of 4-Vinylpyridine on Dense and Porous SiLK for Electroless Plating of Copper and for Retardation of Copper Diffusion
Journal of the Electrochemical Society
Surfaces
Condensed Matter Physics
Optical
Electrochemistry
Sustainability
Materials Chemistry
Magnetic Materials
Renewable Energy
Films
Coatings
Electronic
the Environment
Effects of Additives and Dissolved Oxygen on Electroless Copper Deposition.
Journal of the Metal Finishing Society of Japan
