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Publications by David C. Whalley
Creep Damage Study at Powercycling of Lead-Free Surface Mount Device
Computational Materials Science
Mechanics of Materials
Materials Science
Astronomy
Computer Science
Computational Mathematics
Chemistry
Physics
Related publications
Finite Element Analysis of Lead-Free Surface Mount Devices
Computational Materials Science
Mechanics of Materials
Materials Science
Astronomy
Computer Science
Computational Mathematics
Chemistry
Physics
Creep Behavior of Annealed Lead-Free Solder for High-Power Electronic Device
DEStech Transactions on Engineering and Technology Research
Concurrent Electromigration and Creep in Lead-Free Solder
Journal of Applied Physics
Astronomy
Physics
Finite Element Analysis of the Creep Damage Process Based on Anisotropic Creep Damage Theory.
Transactions of the Japan Society of Mechanical Engineers Series A
Comparative Study of Creep and Relaxation Characteristic of Serrate Structure Surface
DEStech Transactions on Materials Science and Engineering
On the Creep Resistance of Lead-Silicon and Lead-Antimony-Silicon Alloys
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
The Optimisation of the Single Surface Mount Device Placement Machine in Printed Circuit Board Assembly: A Survey
International Journal of Systems Science
Control
Systems Engineering
Computer Science Applications
Theoretical Computer Science
Abbreviated Machining Schedule for Fabricating Beryllium Parts Free of Surface Damage.
Damage of Metallic Materials During High-Temperature Creep
Physical-Chemical Kinetics in Gas Dynamics
