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Publications by David Cuesta
Thermal Modeling and Analysis of 3D Multi-Processor Chips
Integration, the VLSI Journal
Hardware
Electronic Engineering
Electrical
Architecture
Software
Related publications
Polymer/Glass Hybrid DC-MZI Thermal Optical Switch for 3d-Integrated Chips
RSC Advances
Chemistry
Chemical Engineering
Accurate 3D Multi-Material EM-thermal Modelling
AIP Advances
Nanotechnology
Astronomy
Physics
Nanoscience
Multi-Processor Software Lockout
Multi-Scale Modeling of the Viscoelastic Behavior of 3D Woven Composites
Composites Part A: Applied Science and Manufacturing
Mechanics of Materials
Composites
Ceramics
Thermal Modeling and Performance Analysis of a Thermoacoustic Refrigerator
Journal of the Acoustical Society of America
Acoustics
Ultrasonics
Arts
Humanities
Multi-Port Receivers System Analysis and Modeling
Concepts of 3D Terrain Modeling and Geomorphometric Analysis in Mining
Mining and Metallurgy Engineering Bor
Multi-Sensor 3D Scanner for Postural Analysis
Multi-Resolution Modeling for Extremely High Resolution 3D Scanned Faces