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Publications by E. R. Hackney

Effects of Moisture in the 9975 Shipping Package Fiberboard Assembly

2010English

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Status Report for Moisture Effects on Compaction of Fiberboard in a 9975 Shipping Package

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Third Status Report: Testing of Aged Softwood Fiberboard Material for the 9975 Shipping Package

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Destructive Examination of Shipping Package 9975-02101

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Destructive Examination of Shipping Package 9975-02168

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Examination of Shipping Packages 9975-01818, 9975-01903 and 9975-02287

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Effect of Initial Moisture Content of Chips and Steaming Time on the Properties of Medium Density Fiberboard

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PROTECTIVE SHIPPING PACKAGE FOR 5-Inch-Diameter UF$sub 6$ CYLINDER.

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In-Package MEMS-based Thermal Actuators for Micro-Assembly

Journal of Micromechanics and Microengineering
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Safety Analysis Report for the TRUPACT-II Shipping Package (Condensed Version). Volume 2, Rev. 14

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