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Publications by E. Y. T. Adesta
Electro-Discharge Machining of Alumina: Investigation of Material Removal Rate and Surface Roughness
Journal of Mechanical Engineering and Sciences
Mechanics of Materials
Industrial
Mechanical Engineering
Energy Engineering
Fuel Technology
Manufacturing Engineering
Computational Mechanics
Power Technology
Related publications
Material Removal Rate and Surface Roughness of SiC/Al Matrix Composites Machined by Wire Electrical Discharge Machining: Experimental Method
Environmentally Conscious Machining of Inconel 718: Surface Roughness, Tool Wear, and Material Removal Rate Assessment
International Journal of Advanced Manufacturing Technology
Control
Systems Engineering
Industrial
Mechanical Engineering
Manufacturing Engineering
Computer Science Applications
Software
Investigation on the Surface Roughness of the High Steel Material After Wire Electrical Discharge Machining Process
International Journal of ADVANCED AND APPLIED SCIENCES
Material Removal Rate and Tool Wear Rate on Machining of Inconel 718 Using Electrical Discharge Machine
Research & Development in Material Science
Design and Experimental Investigation of Electro Chemical Discharge Machining of Tiny Glass
Electro-Discharge Machining of Gold Alloys
Gold Bulletin
Materials Science
Inorganic Chemistry
Improvement of Material Removal Rate of Ti-6Al-4v Alloy by Electrical Discharge Machining With Multiple Ultrasonic Vibration.
Keikinzoku/Journal of Japan Institute of Light Metals
Mechanics of Materials
Alloys
Materials Chemistry
Metals
Mechanical Engineering
Prediction of Surface Roughness of Ti-6Al-4v in Electrical Discharge Machining: A Regression Model
Journal of Mechanical Engineering and Sciences
Mechanics of Materials
Industrial
Mechanical Engineering
Energy Engineering
Fuel Technology
Manufacturing Engineering
Computational Mechanics
Power Technology
An Analysis of Surface Roughness and Material Removal Rate in Cylindrical Grinding of Hardened OHNS Using Response Suface Method
International Journal of Engineering Research and
