Discover open access scientific publications

Search, annotate, share and cite publications

Publications by E.N. Glytsis

Substrate-Embedded and Flip-Chip-Bonded Photodetector Polymer-Based Optical Interconnects: Analysis, Design, and Performance

Journal of Lightwave Technology

Molecular Physics,

English

Related publications

Analysis of Chip/Bump/Ceramic Interface of Flip-Chip Bonded LED Directly on Ceramic Packages

Journal of Light and Visual Environment

Electronic Engineering

English

On-Chip Positionable Photonic Waveguides for Chip-To-Chip Optical Interconnects

English

Microring and Microdisk Resonator-Based Devices for On-Chip Optical Interconnects, Particle Manipulation, and Biosensing

English

Fluxless Flip-Chip Bonding of Single Photodetector Chips Using Laser-Induced Forward Transfer

English

Lateral Buckling and Mechanical Stretchability of Fractal Interconnects Partially Bonded Onto an Elastomeric Substrate

Applied Physics Letters

English

On-Chip Copper-Based vs. Optical Interconnects: Delay Uncertainty, Latency, Power, and Bandwidth Density Comparative Predictions

English

Design and Analysis of the CMOS Compatible Pressure Sensor Using Flip Chip and Flex Circuit Board Technologies

English

Flexible Optical Waveguide Film Fabrications and Optoelectronic Devices Integration for Fully Embedded Board-Level Optical Interconnects

Journal of Lightwave Technology

Molecular Physics,

English

Performance Analysis of Different Designs of All-Optical D Flip Flop

International Journal of Engineering and Technology(UAE)

Chemical Engineering

Environmental Engineering

Computer Science

English