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Publications by Edmund B Webb
A Case Study of Thin Film Stress Evolution at a Dissimilar Material Interface via Molecular Dynamics Simulations
Nanomaterials and Nanotechnology
Electronic Engineering
Optical
Electrical
Magnetic Materials
Biotechnology
Composites
Electronic
Ceramics
Related publications
Thermal Conductivity of Amorphous SiO2 Thin Film: A Molecular Dynamics Study
Scientific Reports
Multidisciplinary
Molecular Dynamics Simulations of the Hydrophobin SC3 at a Hydrophobic/Hydrophilic Interface
Proteins: Structure, Function and Genetics
Biochemistry
Structural Biology
Molecular Biology
Application of Molecular-Dynamics Simulation to Interface Stabilization in Thin-Film Devices
JSME International Journal Series B
Crack Point Stress Singularities at a Bi-Material Interface
Journal of Applied Mechanics, Transactions ASME
Mechanics of Materials
Condensed Matter Physics
Mechanical Engineering
Dynamics of a Reactive Thin Film
Mathematical Modelling of Natural Phenomena
Modeling
Applied Mathematics
Simulation
Surface Removal of a Copper Thin Film in an Ultrathin Water Environment by a Molecular Dynamics Study
Friction
Surfaces
Films
Coatings
Mechanical Engineering
Thermal Transport During Thin-Film Argon Evaporation Over Nanostructured Platinum Surface: A Molecular Dynamics Study
Proceedings of the Institution of Mechanical Engineers, Part N: Journal of Nanomaterials, Nanoengineering and Nanosystems
Electronic Engineering
Electrical
Condensed Matter Physics
Materials Science
Stress Analysis Around a Circular Interface Crack Between Dissimilar Media.
Doboku Gakkai Ronbunshu
Semiconductor Surface and Interface Dynamics From Tight‐binding Molecular Dynamics Simulations
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Surfaces
Films
Interfaces
Condensed Matter Physics
Coatings