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Publications by Ei UCHIDA

Mass Balance and Deposition Mechanism in Electroless Pd-P Alloy Plating From a Ethylenediamine Complex Bath Using Hypophosphite as a Reducing Agent.

Journal of the Surface Finishing Society of Japan

English

Mass Balance and Deposition Mechanism of Electroless Palladium Plating Using Trimethylamine Borane as a Reducing Agent.

Journal of the Surface Finishing Society of Japan

English

Electrodeposition of Copper From Ethylenediamine Complex Bath for ULSI Metallization.

Journal of the Surface Finishing Society of Japan

English

Electrodeposition of Sn-0.7Cu-0.3Ag Ternary Alloy From Methanesulfonate Bath for Pb-Free Soldering.

Journal of Japan Institute of Electronics Packaging

Electronic Engineering

English