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Publications by Erik Poppe
Conductivity of High-Temperature Annealed Silicon Direct Wafer Bonds
Microsystem Technologies
Electronic Engineering
Condensed Matter Physics
Nanoscience
Hardware
Optical
Electrical
Architecture
Magnetic Materials
Nanotechnology
Electronic
Related publications
Low Temperature Direct Electroless Nickel Plating on Silicon Wafer
Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an
Engineering
Reduction of Thermal Conductivity in Wafer-Bonded Silicon
Applied Physics Letters
Astronomy
Physics
Photoluminescence of Monocrystalline and Stain-Etched Porous Silicon Doped With High Temperature Annealed Europium
Journal of Physics D: Applied Physics
Surfaces
Ultrasonics
Condensed Matter Physics
Acoustics
Optical
Magnetic Materials
Films
Coatings
Electronic
Effects of Temperature Conditions on Fracture Toughness of Single Crystal Silicon Wafer
Mechanical Engineering Journal
High Temperature–high Pressure Thermal Conductivity of Argon
Journal of Chemical Physics
Medicine
Theoretical Chemistry
Astronomy
Physics
Physical
Reactive Diffusion Between Ultra High Purity Iron and Silicon Wafer
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
High Temperature Deformation of Silicon Carbides.
Materia Japan
High-Temperature Thermal Conductivity Measurements in Semiconductors
Silicon Waveguides Produced by Wafer Bonding
Applied Physics Letters
Astronomy
Physics
