Amanote Research
Register
Sign In
Discover open access scientific publications
Search, annotate, share and cite publications
Publications by F.Y. Génin
Mechanism of Electromigration Failure in Al Thin Film Interconnects Containing Sc
Materials Research Society Symposium - Proceedings
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Related publications
Modeling the Electromigration Failure Time Distribution in Short Copper Interconnects
Journal of Applied Physics
Astronomy
Physics
Electromigration of Electroplated Gold Interconnects
Materials Research Society Symposium - Proceedings
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
ELECTROREFLECTANCE OF THIN FILM Al-ZnS-Al SANDWICHES
Le Journal de Physique Colloques
In Situ X-Ray Microscopy Studies of Electromigration in Copper Interconnects
AIP Conference Proceedings
Astronomy
Physics
Diffusivity Variation in Electromigration Failure
Microelectronics Reliability
Surfaces
Electronic Engineering
Condensed Matter Physics
Electronic
Molecular Physics,
Nanoscience
Films
Optical
Electrical
Atomic
Magnetic Materials
Nanotechnology
Reliability
Safety
Coatings
Optics
Quality
Risk
Copper Interconnects Grown by Electrochemical Displacing the Prepatterned SiC Barrier Thin Film
Electrochemical and Solid-State Letters
Calculation of the Electromigration Wind Force in Al Alloys
Physical Review B
A New Thin Film Photochromic Material: Oxygen-Containing Yttrium Hydride
Solar Energy Materials and Solar Cells
Surfaces
Renewable Energy
Sustainability
Optical
Magnetic Materials
Films
Coatings
Electronic
the Environment
Liquid Cell TEM of Al Thin Film Corrosion Under Potentiostatic Polarization
Microscopy and Microanalysis
Instrumentation
