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Publications by Frederic Lafon

EMC Performance Analysis of a Processor/Memory System Using PCB and Package-On-Package

2015English

Related publications

Computational Analysis on Thermal Performance of 2.5D Package

Transactions of The Japan Institute of Electronics Packaging
2014English

Package-Interposer-Package (PIP): A Breakthrough Package-On-Package (PoP) Technology for 3d-Integration

International Symposium on Microelectronics
2012English

Design Package 1e System Safety Analysis

1995English

Program Package GRADAP: Graph Definition and Analysis Package

Behavior Research Methods
DevelopmentalArtsPsychologyEducational PsychologyCognitive PsychologyHumanitiesExperimental
1982English

MINUIT Package Parallelization and Applications Using the RooFit Package

2009English

A General Purpose Analysis Package

Atmospheric and Climate Sciences
2012English

Willows: A Memory Efficient Tree and Forest Construction Package

BMC Bioinformatics
BiochemistryApplied MathematicsComputer Science ApplicationsStructural BiologyMolecular Biology
2009English

A BGA Package Routing Algorithm on Sketch Layout System.

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
1997English

The IronChip Evaluation Package: A Package of Perl Modules for Robust Analysis of Custom Microarrays

BMC Bioinformatics
BiochemistryApplied MathematicsComputer Science ApplicationsStructural BiologyMolecular Biology
2010English

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