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Publications by Frederick Ray I. Gomez
Package Design Optimization With Reliability Test Verification for Reduction of Voids and Delamination
Asian Journal of Engineering and Technology
A Methodical Approach in Critical Processes Optimization of New Scalable Package Semiconductor Device for ESD Applications
Asian Journal of Engineering and Technology
Wirebond Process Improvement Through Silicon Die Polyimide Removal
Journal of Engineering Research and Reports
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Multidisciplinary Design Optimization of Airframe and Engine for Emissions Reduction
Design and Optimization of Dynamic Test Samples for Ductile Damage Assessment
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Reliability Based Design Optimization for Multidisciplinary Systems Using Response Surfaces
Design Optimization of Ice Plant Test- Rig
IOSR Journal of Mechanical and Civil Engineering
Multidisciplinary Reliability Design Optimization Under Time-Varying Uncertainties
Advances in Mechanical Engineering
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Novel Photosensitive Solder Resist With High Reliability for Semiconductor Package(II)
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Organic Chemistry
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Materials Chemistry
Plastics