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Publications by Fumio Miyashiro

The Activity of “Electronics Packaging Technology Symposium”

English

Announcement of 2nd Microelectronies Symposium

English

Related publications

Packaging Technology of SiC Power Electronics

Journal of Japan Institute of Electronics Packaging

Electronic Engineering

English

Present Conditions and Perspective of Electronics Components &Amp; Electronics Packaging Technology

Journal of Japan Institute of Electronics Packaging

Electronic Engineering

English

Electronic Packaging Technology View From System Design. Packaging Technology Made New Capability in Electronics Use.

Journal of the Surface Finishing Society of Japan

English

Symposium on Electronics

Multidisciplinary

English

An Introduction to Technical Group Activity of Ultra High-Speed and High-Frequency Electronics Packaging

Journal of Japan Institute of Electronics Packaging

Electronic Engineering

English

Polymeric Materials for Electronics Packaging and Interconnection

ACS Symposium Series

Chemical Engineering

English

Co-Fired AlN–TiN Assembly as a New Substrate Technology for High-Temperature Power Electronics Packaging

Ceramics International

Materials Chemistry

Process Chemistry

Magnetic Materials

English

Focus on Symposium on Flexible Organic Electronics

EPJ Applied Physics

Instrumentation

Condensed Matter Physics

Magnetic Materials

English

2005 Trend of Welding & Joining in Japan Electronics Packaging

Yosetsu Gakkai Shi/Journal of the Japan Welding Society

Mechanics of Materials

Mechanical Engineering

English