Amanote Research
Register
Sign In
Discover open access scientific publications
Search, annotate, share and cite publications
Publications by G. Dumstorff
Investigations Into Packaging Technology for Membrane-Based Thermal Flow Sensors
Journal of Sensors and Sensor Systems
Electronic Engineering
Electrical
Instrumentation
Related publications
Hot-Film and Calorimetric Thermal Air Flow Sensors Realized With Printed Board Technology
Journal of Sensors and Sensor Systems
Electronic Engineering
Electrical
Instrumentation
Semiconductor Packaging Technology for 3D Assembly
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Compliant Press-Fit Technology Integrated Into a New Back Panel Packaging Approach
ElectroComponent Science and Technology
An Universal Packaging Technique for Low-Drift Implantable Pressure Sensors
Biomedical Microdevices
Nanotechnology
Biomedical Engineering
Molecular Biology
Nanoscience
SLC/FCA Packaging Technology.
Journal of SHM
[Geothermal Resource/Reservoir Investigations Based on Heat Flow and Thermal Gradient Data for the US]. 6. Quarterly Technical Progress Report
Special Articles: Theme of Advanced Assembly and Packaging Technology. Breakthrough in Packaging Technology.
Circuit Technology
Editorial for Journal of Packaging Technology and Research
Journal of Packaging Technology and Research
Editorial for Journal of Packaging Technology and Research
Journal of Packaging Technology and Research
