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Publications by Gui-sheng Gan
Effect of Trace Ge on Wettability and High-Temperature Oxidation Resistance of Sn-0.7Cu Lead-Free Solder
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Related publications
Electrochemical Mechanism on Improvement of Wettability by Addition of Lead to Sn-3.4Ag Lead-Free Solder.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Mechanical Characterization of Lead-Free Sn-Ag-Cu Solder Joints by High-Temperature Nanoindentation
Journal of Electronic Materials
Electronic Engineering
Condensed Matter Physics
Optical
Materials Chemistry
Electrical
Magnetic Materials
Electronic
Thermodynamic Analysis and Characterization of Bi–Cu–Sn Alloys as Advanced Lead-Free Solder Materials for High Temperature Application
Journal of Materials Science: Materials in Electronics
Electronic Engineering
Biomedical Engineering
Condensed Matter Physics
Biomaterials
Electronic
Molecular Physics,
Biophysics
Optical
Electrical
Atomic
Magnetic Materials
Bioengineering
Optics
Study on Sn–Ag Oxidation and Feasibility of Room Temperature Bonding of Sn–Ag–Cu Solder
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Lead-Free Solder Paste and VOC-Free Solder Paste.
Journal of SHM
Thermodynamic Properties of Al in Ternary Lead-Free Solder Al-Sn-Zn Alloys
Materials Science-Poland
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Effect of Bi or Sb Addition on High Temperature Deformation Behavior in Sn-Cu-Ni Solder Alloys
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Phase Formation Between Lead-Free Sn–Ag–Cu Solder and Ni(P)∕Au Finishes
Journal of Applied Physics
Astronomy
Physics
Effect of Melting Temperature on Wettability of Sn-Ag-Cu Alloys on Cu Substrate
Journal of Polytechnic
