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Publications by H. Katsumura
Growth Kinetics of Antiphase Domain in Ti3Al Intermetallic Compound
Science and Technology of Advanced Materials
Materials Science
Related publications
Single-Phase Interdiffusion in Intermetallic Compound Ti3Al
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
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Pressure Effect on Elastic Constants and Related Properties of Ti3Al Intermetallic Compound: A First-Principles Study
Materials
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Growth Kinetics of Cu6Sn5 Intermetallic Compound at Liquid-Solid Interfaces in Cu/Sn/Cu Interconnects Under Temperature Gradient
Scientific Reports
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Ductile-Phase Toughening in TiBw/Ti-Ti3Al Metallic-Intermetallic Laminate Composites
Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
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Growth Behavior of Intermetallic Compound in Dissimilar Al-Cu Joints Under Direct Current
Journal of Korean Institute of Metals and Materials
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Environmental Embrittlement in Co3Ti Intermetallic Compound
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
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Diffusion in the Intermetallic Compound NiAl
Physica Status Solidi (a)
Gold-Aluminium Intermetallic Compound Formation
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Applications of TiAl-based Intermetallic Compound.
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