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Publications by H. Shimamoto
Thinning Process Induced Surface Defects in Ultra-Thin Si Wafer
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Kinematics of Ultra Precision Grinding for Large Scale Si Wafer.
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Stress Engineering of the Alkoxide Derived Ferroelectric Thin Film on Si Wafer
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Dicing Process for Thin Silicon Wafer by Using Femtosecond-Laser
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Cleaning Technology and Analysis Technology for Hydrocarbon Contamination on Si Wafer Surface
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An Al2O3/InSb/Si MOS Diode Having an Ultra-Thin InSb Layer
