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Publications by Hailin Bai
Synthesis With Glucose Reduction Method and Low Temperature Sintering of Ag-Cu Alloy Nanoparticle Pastes for Electronic Packaging
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Related publications
Investigation of Gold Nanoparticle Inks for Low-Temperature Lead-Free Packaging Technology
Journal of Electronic Materials
Electronic Engineering
Condensed Matter Physics
Optical
Materials Chemistry
Electrical
Magnetic Materials
Electronic
Properties of Ag Nanoparticle Catalyst for Electroless Cu Plating
Journal of The Surface Finishing Society of Japan
Laser Sintering Technology for Printed Electronics: Minute Wiring and Functional Coating With Ag-Nanoparticle Paste
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Brazing With Cu–Ag Eutectic Alloy for Metal-To-Ceramic Seals
Transactions of the Japan Institute of Metals
Microwave Sintering of Ag-Nanoparticle Thin Films on a Polyimide Substrate
AIP Advances
Nanotechnology
Astronomy
Physics
Nanoscience
Electrochemical Behavior of Ag-Cu Alloy in Alkaline Media
Hemijska Industrija
Chemistry
Chemical Engineering
Solid Phase Sintering of Mechanically Alloyed Fe-Cu Powder Alloy.
Funtai Oyobi Fummatsu Yakin/Journal of the Japan Society of Powder and Powder Metallurgy
Alloys
Industrial
Mechanical Engineering
Metals
Materials Chemistry
Manufacturing Engineering
Precipitation Kinetics and Mechanism in Cu-7 Wt% Ag Alloy
Materials Sciences and Applications
Cu-Sn Alloy Metallization of Polymer Substrate Through Reduction-Diffusion Method Using Ionic Liquid Bath at Medium-Low Temperatures
Electrochemistry
Electrochemistry
