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Publications by Hanae Hata
Interfacial Reactions in Sn-57Bi-1Ag Solder Joints With Cu and Au Metallization
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Related publications
Microstructural Evolution of Eutectic Au-Sn Solder Joints
Improving Tensile and Fatigue Properties of Sn–58Bi/Cu Solder Joints Through Alloying Substrate
Journal of Materials Research
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Properties of Sn-Ag-Bi-In Solder Joints
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Effect of Zn Addition on Interfacial Reactions Between Sn-4Ag Solder and Ag Substrates
Journal of Electronic Materials
Electronic Engineering
Condensed Matter Physics
Optical
Materials Chemistry
Electrical
Magnetic Materials
Electronic
Microstructure of Interface Between Sn-Cu Solder With Ni and Cu Plate
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Wetting Properties of and Interfacial Reactions in Lead-Free Sn-Zn Based Solders on Cu and Cu Plated With an Electroless Ni-P/Au Layer
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Phase Formation Between Lead-Free Sn–Ag–Cu Solder and Ni(P)∕Au Finishes
Journal of Applied Physics
Astronomy
Physics
Mechanical Characterization of Lead-Free Sn-Ag-Cu Solder Joints by High-Temperature Nanoindentation
Journal of Electronic Materials
Electronic Engineering
Condensed Matter Physics
Optical
Materials Chemistry
Electrical
Magnetic Materials
Electronic
The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints
Scientific Reports
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