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Publications by He Xueming
Influence of the Molecular Adhesion Force on the Indentation Depth of a Particle Into the Wafer Surface in the CMP Process
Advances in Materials Science and Engineering
Materials Science
Engineering
Related publications
Viewing Asperity Behavior Under the Wafer During CMP
Electrochemical and Solid-State Letters
Indentation of a Rigid Sphere Into an Elastic Substrate With Surface Tension and Adhesion
Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences
Mathematics
Engineering
Astronomy
Physics
Influence of the Surface Condition on the Adhesion of Composite Materials to Enamel
Physics for Economy
The Effect of Humidity on the Compaction Behavior and the Adhesion Force for Surface-Modified Quartz Powders.
Chemical and Pharmaceutical Bulletin
Medicine
Drug Discovery
Chemistry
The Influence of Grinding Wheel Cleaning Process on the Ground Surface Quality
Mechanik
Numerical Analysis of the Influence of Particle Charging on the Fume Formation Process in Arc Welding
Journal of Physics D: Applied Physics
Surfaces
Ultrasonics
Condensed Matter Physics
Acoustics
Optical
Magnetic Materials
Films
Coatings
Electronic
A Process-Based Investigation Into the Impact of the Congo Basin Deforestation on Surface Climate
Journal of Geophysical Research: Atmospheres
The Effect of Indentation Force and Displacement on Visual Perception of Compliance
Research Into Mutual Influence of Inclusion on the Chain of Pores in the Welded Seam Under the Influence of Thermo-Force Loading
EasternEuropean Journal of Enterprise Technologies
Control
Electronic Engineering
Industrial
Mechanical Engineering
Energy Engineering
Applied Mathematics
Systems Engineering
Manufacturing Engineering
Computer Science Applications
Electrical
Innovation
Management of Technology
Power Technology
