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Publications by Henry G. Stenhouse

Direct Bonding Nd:YAG to Sapphire Wafers

English

Related publications

Bonding Silicon-On-Insulator to Glass Wafers for Integrated Bio-Electronic Circuits

Applied Physics Letters

English

Back-To-Back Substrate Wafer Bonding: A New Approach to the Fabrication of Double-Side Coated Wafers

Applied Physics A: Materials Science and Processing

Materials Science

English

Creating Single Boundary Between Two CdTe (111) Wafers With Controlled Orientation by Wafer Bonding

Microscopy and Microanalysis

Instrumentation

English

Three-Dimensional Imaging for Indirect-Direct Bonding

American Journal of Orthodontics and Dentofacial Orthopedics

English

Three-Dimensional Imaging for Indirect-Direct Bonding Could Expose Patients to Unnecessary Radiation

American Journal of Orthodontics and Dentofacial Orthopedics

English

Photoacoustic Imaging of Voids in Direct Wafer Bonding

Review of Scientific Instruments

Instrumentation

English

Traumatic Macular Hole Secondary to Nd:YAG Laser

Sensory Systems

English

Harnessing Entropy to Direct the Bonding/Debonding of Polymer Systems Based on Reversible Chemistry

Chemical Science

English

Bonding to Hydrogen

American Scientist

Multidisciplinary

English