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Publications by Herbert Reichl
Solidification and Wetting Behaviour of SnAgCu Solder Alloyed by Reactive Metal Organic Flux
Soldering and Surface Mount Technology
Electronic Engineering
Electrical
Condensed Matter Physics
Materials Science
Related publications
Predictive Modeling of Reactive Wetting and Metal Joining.
In Situ Investigation of SnAgCu Solder Alloy Microstructure
Journal of Alloys and Compounds
Mechanics of Materials
Alloys
Materials Chemistry
Metals
Mechanical Engineering
Formation of Sn Dendrites and SnAg Eutectics in a SnAgCu Solder
Scripta Materialia
Mechanics of Materials
Materials Science
Alloys
Condensed Matter Physics
Mechanical Engineering
Metals
Nanoscience
Nanotechnology
The Role of Physico-Chemical Properties of Liquid Solder in Reactive Wetting: The Cu/SnZnIn System
Journal of Mining and Metallurgy, Section B: Metallurgy
Mechanics of Materials
Geotechnical Engineering
Alloys
Engineering Geology
Materials Chemistry
Metals
Reactive Wetting of Ceramics by Liquid Metals
Materials Transactions, JIM
Quasiparticles and Fermi Liquid Behaviour in an Organic Metal
Nature Communications
Astronomy
Genetics
Molecular Biology
Biochemistry
Chemistry
Physics
Solidification of Oils and Organic Liquids
Spreading and Solidification of a Molten Microdrop in the Solder Jet Bumping Process
IEEE Transactions on Components and Packaging Technologies
Synthesis and Processing of Composites by Reactive Metal Penetration
