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Publications by Hidemi NAWAFUNE

Mass Balance and Deposition Mechanism in Electroless Pd-P Alloy Plating From a Ethylenediamine Complex Bath Using Hypophosphite as a Reducing Agent.

Journal of the Surface Finishing Society of Japan

1993

English

Mass Balance and Deposition Mechanism of Electroless Palladium Plating Using Trimethylamine Borane as a Reducing Agent.

Journal of the Surface Finishing Society of Japan

1996

English

Indirect Determination of pH in Electroless Copper Plating Bath by Spectrophotometry.

Journal of the Metal Finishing Society of Japan

1985

English

Formation of ULSI Interconnection by Copper Electrodeposition Process Using the Pre-Adsorption of Polyethylene Glycol Derivative

Journal of The Surface Finishing Society of Japan

2007

English

Production of PWBs Possessing Both Superior Solderability and Contact Characteristics. Application of an Electroless Pd-P Alloy Plating Process.

Circuit Technology

1993

English

Preliminary Study on Electroplating by Vibration Method

Journal of the Metal Finishing Society of Japan

1974

English

Electrodeposition of Copper From Ethylenediamine Complex Bath for ULSI Metallization.

Journal of the Surface Finishing Society of Japan

1999

English

Crystal Structure and Properties of Electrodeposited Palladium-Nickel-Phosphorus Alloy.

Journal of the Surface Finishing Society of Japan

1994

English

Direct Metallization Using Sulfonation of Coat-Type Epoxy Resin for Manufacture of Printed Wiring Board by "Build Up Process".

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

1996

English

In Situ Monitoring of Electroless Nickel-Phosphorous Alloy Plating Baths by Fourier Transform Infrared Attenuated Total Reflectance(FTIR ATR) Spectrometry.

Journal of the Surface Finishing Society of Japan

1993

English

Amanote Research

Discover open access scientific publications

Search, annotate, share and cite publications

Publications by Hidemi NAWAFUNE

Mass Balance and Deposition Mechanism in Electroless Pd-P Alloy Plating From a Ethylenediamine Complex Bath Using Hypophosphite as a Reducing Agent.

Mass Balance and Deposition Mechanism of Electroless Palladium Plating Using Trimethylamine Borane as a Reducing Agent.

Indirect Determination of pH in Electroless Copper Plating Bath by Spectrophotometry.

Formation of ULSI Interconnection by Copper Electrodeposition Process Using the Pre-Adsorption of Polyethylene Glycol Derivative

Production of PWBs Possessing Both Superior Solderability and Contact Characteristics. Application of an Electroless Pd-P Alloy Plating Process.

Preliminary Study on Electroplating by Vibration Method

Electrodeposition of Copper From Ethylenediamine Complex Bath for ULSI Metallization.

Crystal Structure and Properties of Electrodeposited Palladium-Nickel-Phosphorus Alloy.

Direct Metallization Using Sulfonation of Coat-Type Epoxy Resin for Manufacture of Printed Wiring Board by "Build Up Process".

In Situ Monitoring of Electroless Nickel-Phosphorous Alloy Plating Baths by Fourier Transform Infrared Attenuated Total Reflectance(FTIR ATR) Spectrometry.