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Publications by Hidemi NAWAFUNE

Electrodeposition of Copper From Ethylenediamine Complex Solution and Properties of Deposit.

Journal of the Surface Finishing Society of Japan

English

Bright Tin Plating From Gluconate Baths.

Journal of the Surface Finishing Society of Japan

English

Electrodeposition of Sn-0.7Cu-0.3Ag Ternary Alloy From Methanesulfonate Bath for Pb-Free Soldering.

Journal of Japan Institute of Electronics Packaging

Electronic Engineering

English