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Publications by Hideo AIDA
High-Efficiency Planarization Method Combining Mechanical Polishing and Atmospheric-Pressure Plasma Etching for Hard-To-Machine Semiconductor Substrates
Mechanical Engineering Journal
Related publications
Study of Chemical Etching and Chemo-Mechanical Polishing on CdZnTe Nuclear Detectors
Journal of Materials Science and Chemical Engineering
Plasma Chemistries for High Density Plasma Etching of SiC
Journal of Electronic Materials
Electronic Engineering
Condensed Matter Physics
Optical
Materials Chemistry
Electrical
Magnetic Materials
Electronic
Development of a High Efficiency Polishing Technology Using Abrasive Control Technique With AC Electric Field for Glass Substrates
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Mechanical Engineering
The Impact of Chemical Mechanical Planarization Polishing on a Surface Textured With Deterministic Microasperities
Atmospheric Pressure Plasma Processing for Surface Finishing. The Characteristics of Atmospheric Pressure Non-Equilibrium Plasma Processing.
Journal of the Surface Finishing Society of Japan
Editorial: Atmospheric Pressure Plasma Polymerization
The Open Plasma Physics Journal
Novel Chemical Mechanical Polishing/Plasma-Chemical Vaporization Machining (CMP/P-CVM) Combined Processing of Hard-To-Process Crystals Based on Innovative Concepts
Sensors and Materials
Materials Science
Instrumentation
Atmospheric Pressure Microwave Plasma Torch for Biomedical Applications
Plasma Medicine
Physics
Astronomy
Biomedical Engineering
Solution Deposition Planarization of Long-Length Flexible Substrates
Applied Physics Letters
Astronomy
Physics
