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Publications by Hiroji YAMADA
Resin-Molded High Frequency Multi-Chip Modules in Face-Up Structure.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Related publications
Optimal Algorithms for Substrate Testing in Multi-Chip Modules
High Performance Design Automation for Multi-Chip Modules and Packages
An Overview of Placement and Routing Algorithms for Multi-Chip Modules
International Journal of High Speed Electronics and Systems
Electronic Engineering
Hardware
Optical
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Architecture
Magnetic Materials
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Formation of Microscopic Voids in Resin Transfer Molded Composites
Multi-Height Structures in Injection Molded Polymer
Microelectronic Engineering
Surfaces
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Condensed Matter Physics
Electronic
Molecular Physics,
Nanoscience
Optical
Electrical
Atomic
Magnetic Materials
Films
Nanotechnology
Optics
Coatings
J0403-1-4 Evaluating Strength of Adhesive Interface Between Ceramic and Resin in Resin-Molded Structures
The proceedings of the JSME annual meeting
The Properties of Compression Molded, Glass Flake Reinforced, Resin Composites
Cup-Shaped Copper Heat Spreader in Multi-Chip High-Power LEDs Application
Optics Express
Optics
Atomic
Molecular Physics,
Multi-Frequency Pulsar Polarimetry at High Frequencies
International Astronomical Union Colloquium
Metallized Ceramic Substrate With Mesa Structure for Voltage Ramp-Up of Power Modules
EPJ Applied Physics
Instrumentation
Optical
Electronic
Condensed Matter Physics
Magnetic Materials
