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Publications by Hiroshi ATARASHI
Effect of Electroless Ni-P / Electrolytic Cu Plating on Solder Joint Reliability Under High Temperature Environment of 200 ℃
Journal of The Surface Finishing Society of Japan
Related publications
Diffusion Barrier Property of Electroless Ni-W-P Coating in High Temperature Zn-5Al/Cu Solder Interconnects
Journal of Alloys and Compounds
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The Influence of Additives in Electroless Nickel Plating Film on the Reliability of Solder Joint
Journal of The Surface Finishing Society of Japan
Effect of Bi or Sb Addition on High Temperature Deformation Behavior in Sn-Cu-Ni Solder Alloys
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
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Effect of Heat Treatment Temperature and Duration on the Tribological Performance of Electroless Ni-P Coating and Its Comparison With Ni-P-W and Ni-P-Cu Coatings
Effect of Electroless Ni-P Plating on the Mechanical Properties of an Al-1.2%Si Alloy
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
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Effect of Internal Stress on Elemental Diffusion and Crystallization of Electroless Ni–Cu–P Deposit on Al
Journal of Materials Research
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In Situ Impedance Analysis for the Electroless Plating of Ni-P-SiC, Ni-P-Diamond Composite Films.
Journal of the Surface Finishing Society of Japan
Properties of Ag Nanoparticle Catalyst for Electroless Cu Plating
Journal of The Surface Finishing Society of Japan
Electroless Ni-B Plating for Electrical Contact Applications
Revista de Metalurgia
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