Amanote Research
Register
Sign In
Discover open access scientific publications
Search, annotate, share and cite publications
Publications by Hiroshi KOMI
Control of Additives in Copper Electrorefining by Using the Hull Cell Test.
Shigen-to-Sozai
Related publications
Synergistic Effect of Additives on the Surface Roughness and Throwing Power of Copper Deposited From Electrorefining Solution
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Copper Filling Using Diallylamine Additives
Journal of The Surface Finishing Society of Japan
Control of Calcium Oxalate Crystallization by Using Polymeric Additives
Acta Crystallographica Section A Foundations of Crystallography
Form of Sb Dissolved Into Electrolyte During Copper Electrorefining.
Shigen-to-Sozai
Some Problems on Hull Cell Test (Part I)
Jitsumu Hyomen Gijutsu
Behaviour of Anode Impurities in Copper Electrorefining. Effect of Lead, Arsenic and Oxygen in Anode.
Shigen-to-Sozai
Plating Time Dependence of Filling Ability With Additives by Copper Electroplating.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Investigation of the Influence of Plating Additives on Lattice Defects in Electrolytic Copper Using Positron Annihilation Technique
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
A Review on the Performance Test of a High-Speed Planing Hull With 35 Knot Speed by Appling the Streamlined Step of Hull Form
Journal of Korean Society of Coastal and Ocean Engineers
